Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Patent
1997-10-07
1999-04-20
Krynski, William
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
438110, 343873, 428 369, H01Q 140, H01L 2331
Patent
active
058952357
DESCRIPTION:
BRIEF SUMMARY
The present invention concerns a transponder of small dimensions. A transponder is an electronic module functioning as emitter-receiver. In general, a responder is adapted to supply an identification signal in response to a received excitation signal, which supplies the energy necessary to enable the transponder to generate the identification signal.
Several transponders of small dimensions are known in the prior art. In the document U.S. Pat. No. 5,025,550, the transponder described is formed by a coil electrically connected to an electronic circuit, this arrangement being located in the interior of a glass case entirely enveloping the electronic arrangement.
In the document U.S. Pat. No. 5,235,326, a transponder is described which is also formed by an electronic arrangement comprising an integrated circuit connected to a coil, this arrangement being located in the interior of a closed casing entirely enveloping the electronic arrangement. To assure the stability of the electronic arrangement, a binding is provided in the interior of this casing.
A similar device is also described in the patent U.S. Pat. No. 4,992,794, where the casing is closed by a plug. Such a solution is also proposed in International Patent Application WO 92/15105. This latter document further proposes other embodiments for coating the electronic arrangement of the transponder. A simple over-moulding of the electronic arrangement or the placement the electronic arrangement between two sheets of thermofusible plastic is envisaged.
Finally, a transponder of the same type is described in International Patent Application WO 92/22827. Various embodiments of the transponder are proposed in this document. According to one particular embodiment (FIG. 4 4 of this document), the introduction of the electronic arrangement, formed by the coil electrically connected to an electronic circuit, into the interior of a tube comprising in its upper part and in the interior of this tube a ring of fusible material, is envisaged. This ring is melted so as to close the entrance opening of the electronic arrangement to form the transponder.
All the transponders previously described present a major inconvenience given that the coating of the envisaged electronic arrangement requires a relatively complex fabrication process which increases the cost of the transponder.
Furthermore, in all the transponders described in the various documents cited hereabove, it is very difficult to ensure a total filling of the external envelope defining a closed casing integrally surrounding the envisaged electronic arrangement in the interior of this casing.
The present invention proposes to alleviate the inconveniences of the prior art transponders described hereabove. To that effect, an aim of the invention is to provide an inexpensive transponder, in which the protection of the electronic arrangement is completely assured.
Another aim of the present invention is to provide a process for manufacturing electronic devices, notably transponders, which enables their manufacture in an industrially manner for a low production cost.
A object of the invention is thus a transponder comprising an electronic arrangement and a coating protecting this electronic arrangement. The device is characterized in that the coating is formed by an external envelope, defining a pocket and presenting an opening, and a solidified binder completely filling the envelope and forming an exterior surface of the device in the region defined by said opening, the electronic arrangement being embedded in the binding.
Due to the particular features of the device according to the invention, the electronic arrangement is properly protected by an open envelope, that is to say, presenting an opening by which the electronic arrangement and the binding have been introduced, and by the filling binding in which the electronic arrangement is embedded. Such a transponder is distinguished from the above-described prior art in that the external envelope is not entirely closed, which avoids at least one operation during th
REFERENCES:
patent: 4042955 (1977-08-01), Imai et al.
patent: 4594644 (1986-06-01), Painter
patent: 4707763 (1987-11-01), Kudo
patent: 4992794 (1991-02-01), Brouwers
patent: 5025550 (1991-06-01), Zirbes et al.
patent: 5235326 (1993-08-01), Beigel et al.
patent: 5357700 (1994-10-01), Schulte
patent: 5697384 (1997-12-01), Miyawaki
EM Microelectronic-Marin SA
Krynski William
Lam Cathy F.
LandOfFree
Process for manufacturing transponders of small dimensions does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for manufacturing transponders of small dimensions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for manufacturing transponders of small dimensions will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2244062