Process for producing a semiconductor chip

Details Process for producing a semiconductor chip Process for producing a semiconductor chip

2005-07-19

2005-07-19

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S124000, C438S126000

Reexamination Certificate

active

06919232

ABSTRACT:
A process for producing a semiconductor chip having contact elements protruding on one chip side within the context of wafer level packaging, the chip side provided with the contact elements being coated with a covering compound forming a protective layer, from which the protruding contact element project.

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Korean Office Action dated Oct. 28, 2004.

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