Process for producing a functional device-mounted module

Details Process for producing a functional device-mounted module Process for producing a functional device-mounted module

2008-08-08

2010-06-01

Monbleau, Davienne (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C257S787000, C257SE51020, C257SE23127, C257SE23193

Reexamination Certificate

active

07727819

ABSTRACT:
The present disclosure provides an optical functional device-mounted module which needs no expensive or special members, can be reduced in size, and provide a producing process thereof. A bank to dam a liquid sealing resin is provided on a substrate around an optical functional device, the substrate being formed with a predetermined wiring pattern and having the optical functional device mounted thereon. The liquid sealing resin is filled between the functional device and the bank by dropping the liquid sealing resin therebetween. A package component member having a light transmission hole corresponding to an optical function part of the optical functional device is brought into contact with the bank such that the light transmission hole is opposed to the function part of the optical functional device, thereby causing the package component member to contact with the liquid sealing resin. The package component member is fixed onto the substrate by curing the liquid sealing resin and the bank is finally cut off and removed.

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