Repairable semiconductor device and method

Details Repairable semiconductor device and method Repairable semiconductor device and method

2008-07-07

2011-12-13

Trinh, Hoa B (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257SE21499

Reexamination Certificate

active

08076180

ABSTRACT:
Repairable semiconductor device and method. In one embodiment a method, provides a first body having a first semiconductor chip and a first metal layer. A second body includes a second semiconductor chip and a second metal layer. Metal of the first metal layer is removed. The first semiconductor chip is removed from the first body. The second body is attached to the first body. The first metal layer is electrically coupled to the second metal layer.

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