Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-10-04
2008-03-25
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S118000, C257SE21237
Reexamination Certificate
active
07348216
ABSTRACT:
A method for the removal of residual UV radiation-sensitive adhesive from the surfaces of semiconductor wafers, remaining thereon from protective UV radiation-sensitive tapes which were stripped from the semiconductor wafers. Moreover, provided is an arrangement for implementing the removal of residual sensitive adhesive, which remain from tapes employed as protective layers on semiconductor wafers, particularly wafers having surfaces including C4 connections.
REFERENCES:
patent: 4714511 (1987-12-01), Nakao
patent: 4925515 (1990-05-01), Yoshimura et al.
patent: 5106439 (1992-04-01), Wellings et al.
patent: 5246533 (1993-09-01), Mochizuki
patent: 5310442 (1994-05-01), Ametani
patent: 5981391 (1999-11-01), Yamada
patent: 6007654 (1999-12-01), McKenna
patent: 6256152 (2001-07-01), Coldrey et al.
patent: 6716295 (2004-04-01), Yamamoto
patent: 6872268 (2005-03-01), David et al.
patent: 7025891 (2006-04-01), Codding et al.
patent: 7060526 (2006-06-01), Farnworth et al.
patent: 2002/0014465 (2002-02-01), Chung
patent: 2005/0045591 (2005-03-01), Codding et al.
patent: 2005/0170547 (2005-08-01), Patel et al.
Codding Steven R.
Krywanczyk Timothy C.
Sprogis Edmund J.
Sylvestre Jocelyn
Whalen Matthew R.
Lebentritt Michael
Nikmanesh Seahvosh
Scully , Scott, Murphy & Presser, P.C.
Steinberg William H.
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