Rotary chip attach process

Details Rotary chip attach process Rotary chip attach process

2009-07-09

2010-10-26

Dang, Phuc T (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S109000, C438S464000, C257S723000, C257S731000

Reexamination Certificate

active

07820481

ABSTRACT:
A rotary chip attach process and manufacturing approach takes chips (e.g., integrated circuits (ICs)) from a wafer in a rotary process. A chip wafer with a positioning unit is placed over the top of a sprocketed wheel that picks the ICs directly from the wafer and moves them in a semi-continuous in-step motion to a web that will accept the ICs. The sprocketed wheel includes chips that are preferably the same type as used in a typical pick-and-place robotic system, with vacuum heads adapted to pierce the wafer flat membrane (if needed), grab and IC and place and IC as desired. This positioning system keeps the IC's placement in an accurate position on the web, which can be made to move continuously with a plurality of sprocketed wheel placement units in place.

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