Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-12-25
2007-12-25
Feely, Michael J. (Department: 1712)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C428S413000, C428S414000, C428S416000, C523S440000, C523S443000, C523S457000, C523S458000, C523S466000
Reexamination Certificate
active
10941883
ABSTRACT:
A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide particles constituted by silicon dioxide and at least one metal oxide selected from the group consisting of oxides of metal atoms belonging to Group III and Group IV of the Periodic Table excluding silicon; a semiconductor device comprising a wiring circuit board, a semiconductor element, and the above resin composition; and a method for manufacturing a semiconductor device comprising the steps of adhering a resin sheet comprising the resin composition of claim 1 and a stripping sheet to a semiconductor circuit side of a bump-mounting wafer, removing the stripping sheet leaving only the resin composition to the wafer, and cutting the wafer into individual chips.
REFERENCES:
patent: 5175199 (1992-12-01), Asano et al.
patent: 7109591 (2006-09-01), Hack et al.
patent: 2002/0058145 (2002-05-01), Kanamaru et al.
patent: 2002/0058742 (2002-05-01), Honda et al.
patent: 6-65475 (1994-03-01), None
patent: 11-74424 (1999-03-01), None
patent: 2001-144120 (2001-05-01), None
patent: 2002-088222 (2002-03-01), None
patent: 2002-118147 (2002-04-01), None
patent: 2003-138100 (2003-05-01), None
Machine translation of JP 2002-118147.
Machine translation of JP 06-065475.
Machine translation of JP 11-074424.
Feely Michael J.
Nitto Denko Corporation
LandOfFree
Resin composition for encapsulating semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Resin composition for encapsulating semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin composition for encapsulating semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3834163