Sequential deposition of tantalum nitride using a...

Sequential electron induced chemical vapor deposition

Sequential reducing plasma and inert plasma pre-treatment...

Sequential station tool for wet processing of semiconductor...

Shadow mask a method of forming the shadow mask, and a...

Shallow trench isolation using antireflection layer

Shapes-based migration of aluminum designs to copper damascence

Shapes-based migration of aluminum designs to copper damascene

Shrinking contact apertures through LPD oxide

Shrinking contact apertures through LPD oxide

Si seasoning to reduce particles, extend clean frequency,...

Si seasoning to reduce particles, extend clean frequency,...

Si-rich surface layer capped diffusion barriers

Side wall passivation films for damascene cu/low k...

Sidewall coverage for copper damascene filling

Sidewall protection for a via hole formed in a...

Sidewall sealing of porous dielectric materials

Sidewall spacer structure for self-aligned contact and...

Sidewall treatment for low dielectric constant (low K)...

Sidewalls for guiding the via etch