Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-03-13
2007-03-13
Ghyka, Alexander (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S687000, C438S692000, C438S716000, C205S081000, C205S102000, C257SE21290
Reexamination Certificate
active
10693223
ABSTRACT:
Methods and apparatus are provided for processing semiconductor wafers sequentially. Sequential processes employ multi-station processing modules, where particular encompassing wafer processes are divided into sub-processes, each optimized for increasing wafer to wafer uniformity, result quality, and overall wafer throughput. In one example, a copper electroplating module includes separate stations for wetting, initiation, seed layer repair, fill, overburden, reclaim, and rinse.
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Broadbent Eliot
Cacouris Theodore
Mayer Steven T.
Patton Evan E.
Beyer & Weaver, LLP
Ghyka Alexander
Novellus Systems Inc.
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