Method for controlling poly 1 thickness and uniformity in a...

Method for controlling solder bump shape and stand-off height

Method for controlling tensile and compressive stresses and mech

Method for controlling the formation of intermetallic...

Method for controlling the grain size of tungsten films

Method for controlling voiding and bridging in silicide...

Method for copper doping of aluminum films

Method for correcting an optical proximity effect in an...

Method for creating a damascene interconnect using a...

Method for creating a die shrink insensitive semiconductor...

Method for creating barrier layers for copper diffusion

Method for creating barriers for copper diffusion

Method for creating conductive elements for semiconductor...

Method for creating electrically conductive elements for...

Method for creating flip-chip conductive-polymer bumps using...

Method for creating partially UV transparent anti-reflective...

Method for creating self-aligned alloy capping layers for...

Method for creating via hole in chip

Method for Cu metallization of highly reliable dual...

Method for current ballasting and busing over active device area