Method for controlling solder bump shape and stand-off height

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

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438612, 438126, 438106, H01L 2144

Patent

active

059267313

ABSTRACT:
A conductor (112) and method for attaching a surface mount device to the conductor (112), in which solder bumps (16) formed by the method are characterized as being accurately located on the conductor (112) and having a bump height and shape that provides stress relief during thermal cycles, minimizes bridging between adjacent bumps (16), allows penetration of cleaning solutions for removing undesirable residues, and enables the penetration of mechanical bonding and encapsulation materials between the chip and its substrate (10). Such benefits are achieved by forming the conductor (112) of a nonsolderable material, on which a solderable pillar (114) is formed. The pillar (114) is selectively formed to have a shape that determines the distribution and height of the solder bump (16) on the conductor (112).

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