Method for controlling tensile and compressive stresses and mech

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

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438686, H01L 2144

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active

058343741

ABSTRACT:
A method for forming thin films and controlling the tensile and compressive stresses and mechanical properties of the thin film. The method includes forming an alloy on a substrate having a solvent metal and a solute, then annealing the substrate and the alloy in one of an oxidizing, nitriding and carborizing ambient so that the ambient reacts with the solute to form respectively one of an oxide, nitride and carbide precipitates of the solute in the solvent. The solute is selected so that the precipitates formed may be used to control the mechanical properties of the solvent.

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