Clad system for brazing to alumina
Composite metallic ultrafine particles and process for...
Controlled chemical reduction of surface film
Cost effective substrate fabrication for flip-chip packages
Cryogenic glass-to-metal seal
Debondable metallic bonding method
Device for assembling semiconductor chips between two heat sinks
Device mounting
Die attachment process
Diebonding geometry for packaging optoelectronics
Different materials bonded member and production method thereof
Different materials bonded member and production method thereof
Direct bonding of copper composites to ceramics
Direct bonding of metals to ceramics and metals
Direct brazing of refractory metal features
Direct metal brazing to cermet feedthroughs
Double side cooled, pressure mounted semiconductor package and p
Dual solder process for connecting electrically conducting termi
Earth-boring bit with improved rigid face seal
Edge braze of metal end cap to ceramic cylinder