Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1976-06-17
1978-12-12
Kelly, Donald G.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228188, 228198, 228219, H01L 2302
Patent
active
041292430
ABSTRACT:
Disclosed is a double side cooled, pressure mounted semiconductor package and a method for the manufacture thereof. The package is formed by directly bonding upper and lower metal contact assemblies to an annular ceramic housing. Assembly is simplified if at least one contact assembly comprises two parts applied sequentially. An annular flange having a central opening approximately the size of the central opening in the annular housing and having an outside diameter larger than the outside diameter of the ceramic housing is direct bonded to one end of the housing simultaneously with a lower semiconductor contact. After a conventional semiconductor pellet is positioned in the housing, the second part, a metal contact disc with an outside diameter approximately equaling the outside diameter of the flange, is positioned thereover. Finally, the flange and the disc are welded around their peripheries.
REFERENCES:
patent: 3224088 (1965-12-01), McNelly
patent: 3550254 (1970-12-01), Greenspan et al.
patent: 3736650 (1973-06-01), Anderson
patent: 3751800 (1973-08-01), Daniels et al.
patent: 3766634 (1973-10-01), Babcock et al.
patent: 3981429 (1976-09-01), Parker
patent: 3994430 (1976-11-01), Cusano et al.
Cusano Dominic A.
Loughran James A.
Sun Yen S. E.
General Electric Company
Kelly Donald G.
Mooney R. J.
Ramsey K. J.
Salai S. B.
LandOfFree
Double side cooled, pressure mounted semiconductor package and p does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Double side cooled, pressure mounted semiconductor package and p, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Double side cooled, pressure mounted semiconductor package and p will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-828497