Device for assembling semiconductor chips between two heat sinks

Details Device for assembling semiconductor chips between two heat sinks Device for assembling semiconductor chips between two heat sinks

1995-06-07

1997-02-11

Bradley, P. Austin

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228212, 437902, B23K 3102, B23K 3704

Patent

active

056012268

ABSTRACT:
A device for mounting chips between two flat heat sinks includes a base provided with an assembly of ramps disposed in a saw-tooth pattern; a plurality of main stops aligned at the bottom of the ramps and open in a direction toward the top of the ramps; and, for each main stop, a median stop protruding from the main stop and dividing it into two sub-stops, each sub-vee for receiving a heat sink disposed in parallel with the associated ramp, the median stop being designed to accommodate a chip.

REFERENCES:
patent: 2964431 (1960-12-01), Kalish et al.
patent: 4868974 (1989-09-01), Masanori
patent: 4956911 (1990-09-01), Zaremba et al.
patent: 5351873 (1994-10-01), Pouet et al.
patent: 5462219 (1995-10-01), Pouet et al.
"Lead-Bonding Placement Apparatus," IBM Tech. Discl. Bull., vol. 28, No. 10 (Mar. 1986) 4337-8.
French Search Report from French Patent Application No. 92 08282, filed Jun. 26, 1992.

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