Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1994-06-01
1995-10-24
Bradley, P. Austin
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228215, 228222, 257782, 257783, B23K10140, B23K 3102
Patent
active
054603188
ABSTRACT:
A solder geometry for epi-down diebonding an optoelectronic component to a heat sink platform includes a solder deposition pattern having exposure windows to create gaps or diebond bridges in the solder pattern. The active regions of the components are disposably registered within the gaps of the solder pattern.
REFERENCES:
patent: 3946334 (1976-03-01), Yonezu et al.
patent: 4663652 (1987-05-01), Nishizawa
L. D. Comerford and M. J. Brady, "Capillary Bonded Components for Injection Laser Transmitter Modules," Electronics Letters, vol. 18, No. 14 (Jul. 8, 1982) pp. 629-631.
Boudreau Robert A.
Sargent Richard H.
Bradley P. Austin
Cannon, Jr. James J.
GTE Laboratories Incorporated
Knapp Jeffrey T.
Lohmann, III Victor F.
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