Direct bonding of copper composites to ceramics

Details Direct bonding of copper composites to ceramics Direct bonding of copper composites to ceramics

1994-06-30

1996-02-13

Bradley, P. Austin

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228198, 2282626, B23K 3100

Patent

active

054906270

ABSTRACT:
A ceramic member (52) is direct-bonded to a copper composite substrate (58) by heating to diffuse copper to the surface (56) of the copper composite substrate, oxidizing the surface of the copper composite substrate following heating, placing a ceramic member in contact with the resulting oxidized substrate, and forming a copper-copper oxide eutectic (54) at the interface between the copper composite substrate and the ceramic member by heating. The eutectic, upon cooling, forms a bond between the copper composite and the ceramic.

REFERENCES:
patent: 3766634 (1973-10-01), Babcock et al.
patent: 4505418 (1985-03-01), Neidig et al.
patent: 4563383 (1986-01-01), Kuneman et al.
patent: 4954386 (1990-09-01), Mizunoya et al.
patent: 5176309 (1993-01-01), Horiguchi et al.

Affiliated with

Also associated with

Rating

Direct bonding of copper composites to ceramics does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Direct bonding of copper composites to ceramics, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Direct bonding of copper composites to ceramics will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-236873