LandOfFree - US Patents - Listing for Metal fusion bonding,Process,Metal to nonmetal with separate metallic filler

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Debondable metallic bonding method

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

Patent

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Device for assembling semiconductor chips between two heat sinks

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

Patent

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Device mounting

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

Patent

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Die attachment process

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

Patent

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Diebonding geometry for packaging optoelectronics

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

Patent

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Different materials bonded member and production method thereof

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

Reexamination Certificate

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Different materials bonded member and production method thereof

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

Reexamination Certificate

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Direct bonding of copper composites to ceramics

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

Patent

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Direct bonding of metals to ceramics and metals

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

Patent

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Direct brazing of refractory metal features

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

Patent

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Direct metal brazing to cermet feedthroughs

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

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Double side cooled, pressure mounted semiconductor package and p

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

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Dual solder process for connecting electrically conducting termi

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

Patent

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