Direct metal brazing to cermet feedthroughs

Details Direct metal brazing to cermet feedthroughs Direct metal brazing to cermet feedthroughs

1982-07-29

1984-12-18

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228903, B23K 112

Patent

active

044886730

ABSTRACT:
An improved method for brazing metallic components to a cermet surface in an alumina substrate eliminates the prior art metallized layer over the cermet via and adjoining alumina surfaces. Instead, a nickel layer is applied over the cermet surface only and metallic components are brazed directly to this nickel coated cermet surface. As a result, heretofore unachievable tensile strength joints are produced. In addition, cermet vias with their brazed metal components can be spaced more closely in the alumina substrate because of the elimination of the prior art metallized alumina surfaces.

REFERENCES:
IBM Technical Disclosure Bulletin, Via Hole Filling Techniques, vol. 12, No. 4, Sep. 1969, F. W. Eurglunes.
IBM Technical Disclosure Bulletin, Charge Method for Multilayer Printed Circuit Card, vol. 11, No. 11, Apr. 1969, Chellis, Ellis and Hermann.
IBM Technical Disclosure Bulletin, Process for Forming Interconnection Contact Terminals in a Multilayer Ceramic Substrate, vol. 25, No. 7A, Dec. 1982, Desai, Melvin, Milkovich, and Urfer.
IBM Technical Disclosure Bulletin, Diffusion Process for Improved Ceramic-to-Metal Bond, vol. 26, No. 8, Jan. 1984, J. F. Sullivan.

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