4. Metal fusion bonding
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  6. Metal to nonmetal with separate metallic filler
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Vacuum die attach for integrated circuits

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Vacuum package having vacuum-deposited local getter and its prep

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Vented cavity, hermetic solder seal

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Reexamination Certificate

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