Dual solder process for connecting electrically conducting termi

Details Dual solder process for connecting electrically conducting termi Dual solder process for connecting electrically conducting termi

1987-01-12

1988-04-26

Godici, Nicholas P.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

2281802, 228187, 228226, 228248, B23K 102, B23K 3102, B23K 3526

Patent

active

047399171

ABSTRACT:
A method of providing improved electrical and physical connections between the electrically conducting terminals of an electronic component and the conductors of a printed circuit board by utilizing a high temperature solder material formed in mounds on defined areas of the conductors, coating the mounds with low temperature solder paste and mating the terminals of the component to the mounds by forcing them through the low temperature solder coatings prior to reflowing and cooling the low temperature solder.

REFERENCES:
patent: 3392442 (1968-07-01), Napier et al.
patent: 3621564 (1971-11-01), Tanaka et al.
patent: 3702500 (1972-11-01), Gorinas et al.
patent: 4000842 (1977-01-01), Burns
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4164778 (1979-08-01), Sawairi et al.
patent: 4208005 (1980-06-01), Nate et al.
patent: 4311267 (1982-01-01), Lim
patent: 4376505 (1983-03-01), Wojcik
patent: 4402450 (1983-09-01), Abraham et al.
patent: 4413309 (1983-11-01), Takahashi et al.
patent: 4494688 (1985-01-01), Hatada et al.
patent: 4605153 (1986-08-01), Van Den Brekel et al.
patent: 4607782 (1986-08-01), Mims
Investigation of Discrete Component Chip Mounting Technology for Hybrid Microelectronic Circuits, by Salvadore V. Caruso et al, NASA-TM-X-64937, May 1975.

Affiliated with

Also associated with

Rating

Dual solder process for connecting electrically conducting termi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dual solder process for connecting electrically conducting termi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dual solder process for connecting electrically conducting termi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-815162