Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1989-10-18
1991-02-26
Heinrich, Sam
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228124, 2281802, 228190, 228208, 228254, H01L 2160, H01S 302, B23K10140
Patent
active
049955462
ABSTRACT:
A technique for assembling semiconductor devices in which semiconductor elements, especially lasers or LEDs, are mounted on a first packaging element such as a heat spreader that is mounted on a second packaging element such as a heat sink. Handling of solder preforms is avoided by coating at least one of each of the pairs of surfaces to be brought into contact with a layer of solder and heating the assembly to melt both solder layers in a single operation. In a preferred embodiment a heat spreader is coated in solder on both sides and interposed between a semiconductor element and a heat sink and the assembly is heated. Molybdenum may be used as a layer to aid wetting and adhesion and gold/tin solder may be used. Slightly different solidification temperatures and compositons for the layers may result from different take up of metallization layers from the components into the solder.
REFERENCES:
patent: 3922775 (1975-12-01), Potter
patent: 4389557 (1983-06-01), Devenyi et al.
patent: 4465223 (1984-08-01), Cammarano et al.
patent: 4772935 (1988-09-01), Lawler et al.
patent: 4817849 (1989-04-01), Yamamoto et al.
patent: 4875617 (1989-10-01), Citowsky
BT&D Technologies Limited
Heinrich Sam
LandOfFree
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