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Surface mount package for a micromachined device

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal
Reexamination Certificate

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Surface mount package for linear array sensors

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Surface mount package including terminal on its side

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Surface mount package with heat transfer feature

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Surface mount package with high thermal conductivity

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Surface mount package with improved heat transfer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Surface mount package with integral electro-static charge...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
Reexamination Certificate

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Surface mount package with low coefficient of thermal expansion

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Surface mount peripheral leaded and ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Surface mount peripheral leaded and ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Surface mount semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Surface mount semiconductor diode device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Surface mount semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Surface mount semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Surface mount semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Surface mount semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Surface mount solder method and apparatus for decoupling...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Surface mount solder method and apparatus for decoupling...

Active solid-state devices (e.g. – transistors – solid-state diode – Contacts or leads including fusible link means or noise...
Reexamination Certificate

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Surface mount TO-220 package and process for the manufacture the

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Surface mount type semiconductor device and lead frame...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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