Surface mount TO-220 package and process for the manufacture the

Details Surface mount TO-220 package and process for the manufacture the Surface mount TO-220 package and process for the manufacture the

1997-09-30

2000-09-05

Potter, Roy

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257787, H01L 23495

Patent

active

061147508

ABSTRACT:
A surface mount TO-220 package includes leads which are bent within the molded housing and formed prior to molding the housing around the lead frame. A single gauge of frame material is used for both the leads and the main pad area. The bends reduce the height of the package and reduce mechanical stresses in the molded housing.

REFERENCES:
patent: 4987473 (1991-01-01), Johnson
patent: 5191403 (1993-03-01), Nakazawa
patent: 5291059 (1994-03-01), Ishitsuka et al.

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