Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2007-10-16
2007-10-16
Lee, Eugene (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S081000, C257S099000, C257SE33056
Reexamination Certificate
active
10939972
ABSTRACT:
A surface mount type semiconductor device can be configured to include a pair of lead frames that are butted to each other with a spacing such that ends of the lead frames are opposite to each other. A bare chip can be mounted on a chip mount portion on one end side of one of the lead frames, and wire-bonded to a connection portion on an end side of the other lead frame. A housing can be insert-molded to an end side of both of the lead frames, and the lead frames can be shaped such that they extend along the side and bottom surfaces of the housing and form surface mounting terminal portions. The lead frames are preferably formed to be thin at least at the regions that are to be bent, and other regions thereof are preferably formed to be thick to improve heat radiating effect.
REFERENCES:
patent: 5521429 (1996-05-01), Aono et al.
patent: 6066861 (2000-05-01), Hohn et al.
patent: 6245259 (2001-06-01), Hohn et al.
patent: 6277301 (2001-08-01), Hohn et al.
patent: 6376902 (2002-04-01), Arndt
patent: 6459130 (2002-10-01), Arndt et al.
patent: 6469321 (2002-10-01), Arndt
patent: 6573580 (2003-06-01), Arndt
patent: 6576930 (2003-06-01), Reeh et al.
patent: 6624491 (2003-09-01), Waitl et al.
patent: 6669866 (2003-12-01), Kummer et al.
patent: 6759733 (2004-07-01), Arndt
patent: 6770498 (2004-08-01), Hsu
patent: 6774401 (2004-08-01), Nakada et al.
patent: 6812503 (2004-11-01), Lin et al.
patent: 6822265 (2004-11-01), Fukasawa et al.
patent: 6847116 (2005-01-01), Isokawa
patent: 6888231 (2005-05-01), Maeda
patent: 6927469 (2005-08-01), Arndt et al.
patent: 2003/0038292 (2003-02-01), Wang et al.
patent: 2003/0071365 (2003-04-01), Kobayakawa et al.
patent: 2003/0075724 (2003-04-01), Wang et al.
patent: 2005/0045899 (2005-03-01), Tsutsui
patent: 2005/0127387 (2005-06-01), Chang
patent: 1 022 787 (2003-05-01), None
Cermak Kenealy & Vaidya LLP
Lee Eugene
Stanley Electric Co. Ltd.
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