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Plasma processes for depositing low dielectric constant films

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reexamination Certificate

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Plasma processing method and photoelectric conversion device

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material
Reexamination Certificate

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Plasma treatment at film layer to reduce sheet resistance...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Plasma treatment at film layer to reduce sheet resistance...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Plasma treatment at film layer to reduce sheet resistance...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Plasma treatment at film layer to reduce sheet resistance...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Plasma treatment to enhance inorganic dielectric adhesion to...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Plastic and grid array semiconductor device and method for makin

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Plastic ball grid array assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Plastic ball grid array assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Plastic ball grid array package for passing JEDEC Level 1...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Plastic ball grid array package with improved moisture...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Plastic ball grid array package with integral heatsink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Plastic ball grid array package with integral heatsink

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Reexamination Certificate

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Plastic ball grid array package with strip line configuration

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Plastic body surface-mounting semiconductor power device having

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Plastic electronic component package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Plastic encapsulated IC package and method of designing same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Plastic encapsulated integrated circuit package and method of ma

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Patent

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Plastic encapsulated integrated circuit package having an embedd

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant
Patent

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