Plastic encapsulated integrated circuit package having an embedd

Details Plastic encapsulated integrated circuit package having an embedd Plastic encapsulated integrated circuit package having an embedd

1993-06-23

1995-07-04

Ngo, Ngan V.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

257712, 257722, 257787, 257670, 257675, 257666, H01L 2348, H01L 2940, H01L 2302

Patent

active

054303311

ABSTRACT:
An integrated-circuit die attached to a thermally conductive substrate having surface variations formed into the surface of the thermally conductive substrate. A lead frame has inwardly-extending fingers, which are attached to the thermally conductive substrate. The integrated circuit die, lead frame, and substrate are enclosed within a mold cavity. The surface variations of the thermally conductive substrate provide for a more balanced flow of plastic material over the top and bottom of the substrate provide a molded package body substantially free of voids.

REFERENCES:
patent: 4788583 (1988-11-01), Kawahara et al.
patent: 5105259 (1992-04-01), McShane et al.
patent: 5227662 (1993-07-01), Ohno et al.

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