Plastic ball grid array assembly

Details Plastic ball grid array assembly Plastic ball grid array assembly

1997-12-05

2000-05-16

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257778, 257787, H01L 2348

Patent

active

060641177

ABSTRACT:
An apparatus for enclosing logic chips includes a substrate upon which a logic chip is mounted and a mold cap disposed upon the substrate and covering the logic chip. The mold cap includes at least one extension of sufficient size and shape to provide structural support to a corner section of the substrate.

REFERENCES:
patent: 5708300 (1998-01-01), Woolsley et al.
patent: 5886398 (1999-03-01), Low et al.

Affiliated with

Also associated with

Rating

Plastic ball grid array assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plastic ball grid array assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plastic ball grid array assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-260841