LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Packaged semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Packaged semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Packaged semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Packaged semiconductor device and a lead frame therefor, having

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Packaged semiconductor device and a leadframe therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Packaged semiconductor device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Packaged semiconductor device and method of formation

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Packaged semiconductor device and method of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Packaged semiconductor device and method of manufacturing the sa

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Packaged semiconductor device and method of manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Packaged semiconductor device assembly including two interconnec

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Packaged semiconductor device for radio frequency shielding

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Packaged semiconductor device having bent leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Packaged semiconductor device having tab tape and particular pow

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Packaged semiconductor device including multiple semiconductor c

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Packaged semiconductor device including shielded inner walls

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With heat sink embedded in encapsulant

Packaged semiconductor device incorporating heat sink plate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Packaged semiconductor device suitable to be mounted and connect

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Packaged semiconductor device utilizing leadframe attached on a