Packaged semiconductor device for radio frequency shielding

Details Packaged semiconductor device for radio frequency shielding Packaged semiconductor device for radio frequency shielding

2005-01-25

2005-01-25

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

C257S664000, C257S659000, C257S704000, C257S710000, C257S729000, C257S730000, C257S691000, C257S698000, C257S660000, C257S787000, C257S676000, C257S675000, C257S712000, C257S713000, C361S437000, C361S437000, C361S816000, C361S818000, C174S034000

Reexamination Certificate

active

06847115

ABSTRACT:
A packaged semiconductor device that is fabricated with a plurality of conductive leads defined in a strip that beneficially includes a radio frequency shield box. The conductive contacts are located in a housing, beneficially by insert molding or by sandwiching between a bottom piece and a top piece. The housing can further include a cavity that receives a semiconductor device, and the radio frequency shield can receive another semiconductor device. Bonding conductors electrically connect at least one semiconductor device to another semiconductor device and/or to the conductive contacts. A conductive cover is disposed over the housing. The cavity beneficially includes a beveled wall and the conductive leads and the radio frequency shield are beneficially comprised of copper.

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