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Apparatus and method configured to lower thermal stresses

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Ball grid array semiconductor package comprised of two lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
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Chip package having with asymmetric molding and turbulent...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
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Circuit board with auxiliary wiring configuration to...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
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Circuit device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
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Circuit device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Circuit device and method of manufacture thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Compliant terminal mountings with vented spaces and methods

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
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Component arrangement comprising a carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Components with releasable leads and methods of making...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Compression layer on the lead frame to reduce stress defects

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Compression layer on the leadframe to reduce stress defects

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent

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Compression layer on the leadframe to reduce stress defects

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent

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Compression layer on the leadframe to reduce stress defects

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Computer system including at least one stress balanced...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Conductor frame and housing for a radiation-emitting...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Connection component with releasable leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent

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Contact agency interposed between IC and IC receptacle

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent

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Controlling warping in integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Controlling warping in integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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