LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array socket having improved housing

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array structure and method for packaging an integrated

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array structures and tape-based method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array structures and tape-based method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid assembly with solder columns

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid package with multiple power/ground planes

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball-grid-array-type semiconductor device and its...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball-less clip bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

BGA package and method of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

BGA semiconductor device using insulating film

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

BGA type semiconductor device and electronic equipment using the

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

BGA type semiconductor device and electronic equipment using...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

BGA type semiconductor device and electronic equipment using...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

BGA type semiconductor device and electronic equipment using...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bipolar device and production thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Board-on-chip type substrates with conductive traces in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bonding lead structure with enhanced encapsulation

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Bonding pad test configuration

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Borderless contact structure