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Ceramic composite wiring structures for semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Ceramic lid assembly for semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Ceramic multilayer substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ceramic package for housing a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Ceramic package type electronic part which is high in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ceramic package with radiating lid

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ceramic package, assembled substrate, and manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ceramic semiconductor package and method for fabricating the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ceramic substrate for a semiconductor production/inspection...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ceramic substrate for manufacture/inspection of semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ceramic substrate for semiconductor fabricating device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Ceramic substrate for semiconductor production and inspection

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chain extension for thermal materials

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip assembly with load-bearing lid in thermal contact with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip bead element and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Chip carrier for enabling production of high performance microwa

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Chip cooling channels formed in wafer bonding gap

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip cover

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Chip module for complete power train

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip on board with heat sink attachment and assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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