Ceramic lid assembly for semiconductor packages

Details Ceramic lid assembly for semiconductor packages Ceramic lid assembly for semiconductor packages

1996-07-29

1998-10-20

Nguyen, Ngoc-Yen

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

428614, 428620, 428632, 428669, 174 524, H01L 2302

Patent

active

058250867

ABSTRACT:
A ceramic lid assembly includes an integral metallized layer provided around the periphery of a ceramic lid substrate to serve as a foundation for a solder layer. A portion of the metallized layer for contact with the ceramic lid substrate is formed from a metallized paste containing glass frits so that the metallized layer is baked to adhere to the ceramic lid by reflowed glass frits. A portion of the metallized layer for contact with the solder layer is formed from a metallized paste containing no glass frits so that substantially no void is formed in the solder layer.

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patent: 5329160 (1994-07-01), Miura et al.
W. Yang, "Preflow Solder Ceramic Lids for Hermatic Packages", Solid State Technology, Dec. 1984, pp. 137-143.

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