Ceramic package, assembled substrate, and manufacturing...

Details Ceramic package, assembled substrate, and manufacturing... Ceramic package, assembled substrate, and manufacturing...

2005-08-08

2008-10-07

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S701000, C257S783000, C257SE23181

Reexamination Certificate

active

07432590

ABSTRACT:
In a ceramic package including one or more ceramic layers and being capable of having an electronic component and a lid fixed to a surface thereof, a surface of a ceramic layer having a sealing electrode for joining the lid through a sealing member and a pad to be connected to input and output electrodes and/or a ground electrode of the electronic component is divided into an inner portion having the pad and an outer portion having the sealing electrode with a stepped side wall as a border for preventing the sealing member from flowing, and one of the inner portion and the outer portion projects relative to the other.

REFERENCES:
patent: 4626960 (1986-12-01), Hamano et al.
patent: 4926240 (1990-05-01), Regione
patent: 5091772 (1992-02-01), Kohara et al.
patent: 5168344 (1992-12-01), Ehlert et al.
patent: 5901050 (1999-05-01), Imai
patent: 362179748 (1987-08-01), None
patent: 10-335964 (1998-12-01), None

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