Hermetically sealed high density multi-chip package

Details Hermetically sealed high density multi-chip package Hermetically sealed high density multi-chip package

1995-05-24

1997-02-04

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257724, 257787, H01L 2334

Patent

active

056001819

ABSTRACT:
An on-board chip package has a hermetically sealed connector mechanically secured to a printed wiring board and electrically connected to input/output pads on the board. Chip dies are mechanically bonded to the board and then individually encapsulated with a suitable potting material. The entire assembly is coated with an encapsulating polymer, which partially overlaps the inboard side of the hermetic connector housing and which provides a relatively smooth, crevice-free outer surface. The entire assembly is then covered, in the preferred embodiment, with a metal layer, to hermetically seal the entire chip-on-board assembly.

REFERENCES:
patent: 4040874 (1977-08-01), Yerman
patent: 4477828 (1984-10-01), Scherer
patent: 4768081 (1988-08-01), Moeller
patent: 5302553 (1994-04-01), Abbott et al.
patent: 5332921 (1994-07-01), Dousen et al.
patent: 5461545 (1995-10-01), Leroy et al.

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