Potted hybrid integrated circuit

Details Potted hybrid integrated circuit Potted hybrid integrated circuit

2005-05-03

2005-05-03

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S787000, C257S790000, C257S723000, C257S685000, C257S690000

Reexamination Certificate

active

06888259

ABSTRACT:
The adhesion between a protective layer, which covers a wiring layer, and a potting material, which covers a microchip, in a hybrid IC is improved without placing an additional material between the protective layer and the potting material. The potting material is separated from other electronic devices on the hybrid IC. To improve adhesion, the surface roughness of the protective layer is increased by adding insulating particles to the protective layer, striking the surface of the protective layer with ceramic particles, or replicating a mesh pattern of a screen mask on the surface of the protective layer. To keep the potting material separated from the other electronic devices, another potting material for covering the electronic devices, which is more viscous than the potting material for covering the microchip, is potted and hardened before the potting material for covering the microchip is potted.

REFERENCES:
patent: 4639830 (1987-01-01), Fukuoka
patent: 6096381 (2000-08-01), Zheng
patent: 6126428 (2000-10-01), Mitchell et al.
patent: 6316840 (2001-11-01), Otani
patent: 6407461 (2002-06-01), Farquhar et al.
patent: 6424541 (2002-07-01), Fazelpour
patent: 6576500 (2003-06-01), Furukawa et al.
patent: 20010007371 (2001-07-01), Kawaguchi
patent: 20020003293 (2002-01-01), Kobayashi
patent: 20020056893 (2002-05-01), Briar
patent: 55-52248 (1980-04-01), None
patent: A-S58-48442 (1983-03-01), None
patent: A-S58-132954 (1983-08-01), None
patent: 62-18739 (1987-01-01), None
patent: 63-162848 (1988-07-01), None
patent: A-H1-209733 (1989-08-01), None
patent: 2-22846 (1990-01-01), None
patent: 3-96257 (1991-04-01), None
patent: 3-153588 (1991-07-01), None
patent: 61-67247 (1996-04-01), None
patent: A-H11-40710 (1999-02-01), None

Affiliated with

Also associated with

Rating

Potted hybrid integrated circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Potted hybrid integrated circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Potted hybrid integrated circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3450645