Plastic package type semiconductor device

Details Plastic package type semiconductor device Plastic package type semiconductor device

1993-09-14

1995-02-21

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

257788, 257793, H01L 2328

Patent

active

053919246

ABSTRACT:
Disclosed is a plastic package type semiconductor device having a semiconductor element encapsulated with an epoxy resin composition, said resin composition containing as indispensable components (a) an epoxy resin, (b) a curing agent, (c) a curing promotor, (d) a first inorganic powder having an average diameter of 5 to 40 .mu.m and a smooth outer surface substantially free from edges, ridges and projections, and (e) a second inorganic powder having an average diameter of 0.1 to 10 .mu.m and a heat conductivity of at least 4.0 W/m.multidot.K, the mixing amount of the first inorganic powder (d) being 10 to 50% by volume based on the sum of the first inorganic powder (d) and the second inorganic powder (e).

REFERENCES:
patent: 5181097 (1993-01-01), Ogata et al.

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