Plastic-encapsulated semiconductor device

Details Plastic-encapsulated semiconductor device Plastic-encapsulated semiconductor device

1994-09-13

1997-06-24

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

257789, 257790, 257795, H01L 2329

Patent

active

056419970

ABSTRACT:
A semiconductor chip is positioned between encapsulating sheets. The encapsulating sheets each have a surface that is highly adhesive and a surface that is less adhesive. The surface of the encapsulating sheet that is highly adhesive contacts the chip. The surface that is less adhesive contacts a mold. Subsequently, encapsulation is carried out by molding. A soldering resistance can be improved without reducing a mold releasing property.

REFERENCES:
patent: 4680617 (1987-07-01), Ross
patent: 4788583 (1988-11-01), Kawahara et al.

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