Optimizing the power connection between chip and circuit...
Optimum padset for wire bonding RF technologies with high-Q...
Organic controlled collapse chip connector (C4) ball grid array
Organic packages having low tin solder connections
Organic substrate for flip chip bonding
Os rectifying Schottky and ohmic junction and W/WC/TiC ohmic con
Outer electrode structure for a chip type electronic part approp
Outer lead for a semiconductor IC package having individually an
Output mapping of die pad bonds in a ball grid array
Oxidation resistant high conductivity copper layers for microele
Oxide semiconductor electrode and process for producing the...
Oxide wire bond insulation in semiconductor assemblies
Oxygen assisted ohmic contact formation to N-type gallium arseni
Oxygen bridge structures and methods to form oxygen bridge...