Formation of ohmic contacts in III-nitride light emitting...
Formation of oxidation-resistant seed layer for interconnect...
Formation of silicided junctions in deep submicron MOSFETS by de
Forming a porous dielectric layer
Forming local interconnects in integrated circuits
Forming of the last metallization level of an integrated...
Forming thick metal interconnect structures for integrated...
Forming ultra dense 3-D interconnect structures
Freestanding multilayer IC wiring structure
Fretting and whisker resistant coating system and method
Front side coating for bump devices
Fully encapsulated metal leads for multi-level metallization
Function element and function element mounting structure
Function element, substrate for mounting function element...
Functional device unit and method of producing the same
Functionally symmetric integrated circuit die
Fuse-structure
Fusing nanowires using in situ crystal growth