Fuse-structure

Details Fuse-structure Fuse-structure

2004-10-22

2009-06-02

Warren, Matthew E. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S529000, C257S775000, C257SE23149

Reexamination Certificate

active

07541676

ABSTRACT:
A metal layer structure is disclosed. The metal layer structure includes a substrate, a first dielectric layer on a surface of the substrate, and at least one first conductor and at least one second conductor on the first dielectric layer. The second conductor has at least one thin portion.

REFERENCES:
patent: 5519658 (1996-05-01), Uda et al.
patent: 5882998 (1999-03-01), Sur et al.
patent: 6175145 (2001-01-01), Lee et al.
patent: 6194304 (2001-02-01), Morozumi
patent: 6356496 (2002-03-01), Carroll
patent: 6375159 (2002-04-01), Daubenspeck et al.
patent: 6707129 (2004-03-01), Wang
patent: 6828653 (2004-12-01), Castagnetti et al.
patent: 6900515 (2005-05-01), Fischer et al.
patent: 2005/0110148 (2005-05-01), Lee et al.

Affiliated with

Also associated with

Rating

Fuse-structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fuse-structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fuse-structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4057670