Forming thick metal interconnect structures for integrated...

Details Forming thick metal interconnect structures for integrated... Forming thick metal interconnect structures for integrated...

2011-06-21

2011-06-21

Toledo, Fernando L (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C438S618000

Reexamination Certificate

active

07964965

ABSTRACT:
Embodiments of an apparatus and methods for forming thick metal interconnect structures for integrated structures are generally described herein. Other embodiments may be described and claimed.

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