Function element and function element mounting structure

Details Function element and function element mounting structure Function element and function element mounting structure

2005-07-29

2011-10-25

Gebremariam, Samuel (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257SE23060

Reexamination Certificate

active

08044511

ABSTRACT:
The semiconductor device is manufactured by forming a lower electrode layer2having a predetermined pattern on a semiconductor substrate1and forming an upper electrode layer3on a part of the top surface of the lower electrode layer2, while holes2X extending in the direction of thickness are formed on the top surface of the lower electrode layer2below the upper electrode layer3, and the depth of holes2X is smaller than the thickness of the lower electrode layer2.

REFERENCES:
patent: 6028011 (2000-02-01), Takase et al.
patent: 6462415 (2002-10-01), Ishiguri et al.
patent: 09069524 (1997-03-01), None
patent: 10130852 (1998-05-01), None
patent: 11-214421 (1999-08-01), None
patent: 2001196404 (2001-07-01), None
patent: 2002237497 (2002-08-01), None
patent: 2004172390 (2004-06-01), None
patent: 2004-200247 (2004-07-01), None
patent: 2004200247 (2004-07-01), None
Japanese language office action dated Sep. 21, 2010 and its partial English language translation for corresponding Japanese application 2006527874 lists the reference above.

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