LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Combined with electrical contact or lead

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Chip structure with arrangement of side pads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip structure with bevel pad row

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip structure with bumps and testing pads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip structure with bumps and testing pads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip structure with pads having bumps or wirebonded wires...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip structure with pads having bumps or wirebonded wires...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip structure with redistribution traces

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip structure with redistribution traces

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip structure with redistribution traces

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip to wiring interface with single metal alloy layer...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip underfill in flip-chip technologies

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip with internal signal routing in external element

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip-join process to reduce elongation mismatch between the...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip-on-board assemblies, carrier assemblies and carrier...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip-on-board package having flip chip assembly structure...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip-on-board package having flip chip assembly structure...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip-on-chip connection with second chip located in...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip-on-chip IC packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip-on-chip integrated circuit package and method for making th

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Chip-on-chip interconnections of varied characteristics

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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