Refractory metal nitride barrier layer with gradient...
Refractory metal-titanium nitride conductive structures
Reinforced bond pad
Reliability improvement of SiOC etch with trimethylsilane...
Reliability of metal leads in high speed LSI semiconductors usin
Reliability of metal leads in high speed LSI semiconductors usin
Reliable aluminum interconnect via structures
Reliable low-k interconnect structure with hybrid dielectric
Reliable metallization with barrier for semiconductors
Reliable via structures having hydrophobic inner wall surfaces
Removal of metal cusp for improved contact fill
Residue-free contact openings and methods for fabricating same
Resin sealed semiconductor integrated circuit device
Resistance-reduced semiconductor device and methods for...
Retarding agglomeration of Ni monosilicide using Ni alloys
Reticle for creating resist-filled vias in a dual damascene...
Reworkable thermal interface material
Robust via structure and method
Routing differential signal lines in a substrate
RuSixOy-containing adhesion layers and process for...