Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2005-04-05
2005-04-05
Smith, Brad (Department: 2824)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S741000, C257S750000, C438S652000
Reexamination Certificate
active
06876082
ABSTRACT:
Within a microelectronic fabrication and a method for fabricating the microelectronic fabrication a barrier layer is formed over a substrate. Within the method and the microelectronic fabrication the barrier layer is formed of a refractory metal nitride barrier material having within its thickness a gradient in nitrogen concentration. The barrier layer has low resistivity and improved electromigration performance.
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Lee Hsien-Ming
Liu Chung-Shi
Pan Shing-Chuang
Yu Chen-Hua
Smith Brad
Taiwan Semiconductor Manufacturing Co. Ltd.
Tung & Associates
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