Reinforced bond pad

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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Details

C257S763000, C257S761000, C257S764000

Reexamination Certificate

active

06960836

ABSTRACT:
Disclosed herein is a reinforcing system and method for reinforcing a contact pad of an integrated circuit. Specifically exemplified is a system and method that comprises a reinforcing structure interposed between a top contact pad layer and an underlying metal layer.

REFERENCES:
patent: 5284797 (1994-02-01), Heim
patent: 6143396 (2000-11-01), Saran et al.
patent: 6187680 (2001-02-01), Costrini et al.
patent: 6803302 (2004-10-01), Pozder et al.
patent: 2002/0000671 (2002-01-01), Zuniga et al.
patent: 2002/0187634 (2002-12-01), Saran et al.
patent: 2003/0045088 (2003-03-01), Imai et al.
patent: 2003/0178644 (2003-09-01), Lee et al.

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