Resin sealed semiconductor integrated circuit device

Details Resin sealed semiconductor integrated circuit device Resin sealed semiconductor integrated circuit device

1991-03-01

1993-01-12

Gonzalez, Frank

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257787, H01L 2328

Patent

active

051794357

ABSTRACT:
A resin sealed semiconductor integrated circuit device has an upper wiring layer crossing over a lower wiring layer via an intermediate insulating film. Recesses or protrusions are formed at the side face of the upper wiring layer in the vicinity of its intersecting boundary with the lower wiring layer.

REFERENCES:
patent: 5010388 (1991-04-01), Sasame et al.
patent: 5049969 (1991-09-01), Orbach et al.
patent: 5060045 (1991-10-01), Owada et al.

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