LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Combined with electrical contact or lead,Flip chip

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Structure, materials, and applications of ball grid array...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

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Submount for diode with single bottom electrode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Submount for diode with single bottom electrode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Submount-holder for flip chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Substrate for mounting semiconductor chip, mounting...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

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Substrate for packing semiconductor device and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

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Substrate structure of flip chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

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Substrate, manufacturing method thereof, method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

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Substrateless resin encapsulated semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Patent

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Surface mount and flip chip technology for total integrated circ

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Patent

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Surface-acoustic-wave device for flip-chip mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

System and method for circuit rebuilding via backside access

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

System and method to increase die stand-off height

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

System having semiconductor component with multiple stacked...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Tamper resistant packaging with transient liquid phase bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Tape carrier for BGA and semiconductor device using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

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Tape carrier, manufacturing method of tape carrier and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Tape for chip on film and semiconductor therewith

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Technique for reducing breakage of thinned flip-chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Terminal, semiconductor device, terminal forming method and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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